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| Item | Capability | | PCB Layers | 1-18 Layers | | Base Material | FR4,CEM1,CEM3,Aluminum,Polymide, Rogers,Teflon | | Copper Thickness | 0.5-6 OZ | | Impedance Control | Yes | | Peeable Mask | Yes | | Min.Line Width | 0.08mm | | Min.Line Spacing | 0.08mm | | Min.Annual Ring PTH | 0.15mm | | PTH | 0.20mm±0.05mm | | Non-PTH | 0.15mm±0.05mm | | Hole Aspect Ratio | 10 | | Min.Board Thickness | 1-2layer:0.2mm | | Multilayer(4,6,8,10 layer)0.4mm,0.55mm,0.8mm,0,8mm | | Max Board Sixe | 600*900mm,400*1200mm | | Solder Mask Pitch | 0.1mm | | Outline Tolerance | ±0.15mm | | V-CUT Tolerance | ±0.10mm | | thickness Tolerance | ±0.10mm | | Gold Finger | 5u"-50u" | | Surface Finish | HASL,LF HAL,Immersion Gold,Immersion silver, Flash Gold,Flux Coat&OSP | | Special Capability | Burial/blind vias,Impedance Control,via plug, BGA,Gold Finger | | Test | Flying probe test,E-test,Inspection AOI test | | Certificate | RoHS,ISO9001:2000,ISO14001:2004,SGS,UL |
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